Figure

Description

The silicon spin qubit encodes quantum information in the spin of a single electron (or hole) confined in a gate-defined quantum dot fabricated on a silicon substrate (Si/SiGe heterostructure or Si-MOS). Silicon is uniquely suited to spin qubits because isotopic purification (²⁸Si) eliminates hyperfine noise from nuclear spins, enabling coherence times exceeding 10 ms — orders of magnitude beyond III-V semiconductors.

Gate-defined quantum dots in silicon confine individual electrons using electrostatic potentials created by nanoscale metallic gates on a Si/SiGe or Si-MOS stack. Qubit states are the spin-up and spin-down states of a single electron, split by an external magnetic field (Zeeman splitting, typically ~14–42 GHz at 0.5–1.5 T, with giving ~28 GHz/T). Single-qubit gates use electric dipole spin resonance (EDSR) via a micromagnet gradient or oscillating gate voltages exploiting spin-orbit coupling. Two-qubit gates use the exchange interaction between neighboring dots, controlled by barrier gate voltages.

Silicon’s key advantage is the availability of isotopically enriched ²⁸Si, which has zero nuclear spin. In natural silicon (~4.7% ²⁹Si), hyperfine interaction is the dominant dephasing mechanism. With enrichment to >99.99% ²⁸Si, improves from ~1 μs to >100 μs, and (Hahn echo) exceeds 10 ms.

The materials system also benefits from decades of CMOS fabrication infrastructure, making silicon the most plausible path to industrial-scale qubit manufacturing.

Hamiltonian

Single-qubit Hamiltonian:

Two-qubit exchange Hamiltonian:

where is the exchange coupling controlled by the barrier gate voltage , tunable from <1 kHz to >100 MHz. In the , subspace, this generates a gate. A controlled-phase (CZ) gate is obtained when (the Zeeman energy difference between qubits), which converts the exchange into an effective Ising interaction.

Valley splitting Hamiltonian (silicon-specific):

where is the valley splitting (typically 0.03–1 meV in Si/SiGe, 0.3–1.5 meV in Si-MOS). Insufficient valley splitting is a yield-limiting factor.

Motivation

  • CMOS compatibility: Fabrication leverages existing semiconductor foundry processes — the only qubit technology with a direct path to billion-transistor-scale manufacturing.
  • Isotopic purification: Enriched ²⁸Si eliminates hyperfine noise, giving coherence times 3–4 orders of magnitude better than GaAs spin qubits.
  • Small footprint: Quantum dot pitch ~60–100 nm enables extremely dense qubit arrays.
  • High-temperature operation: Demonstrated at 1 K (vs. 10–20 mK for superconducting qubits), significantly reducing cryogenic overhead.
  • Industry backing: Intel, GlobalFoundries, imec, and UNSW/SQC actively pursuing silicon spin qubits at foundry scale.

Experimental Status

First single-electron spin qubit in Si — Veldhorst et al. (2014):

  • Demonstrated a single-qubit gate with fault-tolerant control fidelity of 99.6% in isotopically enriched ²⁸Si MOS device
  • = 120 μs, (Hahn echo) = 28 ms

Above-threshold two-qubit gates — Noiri et al. (2022):

  • Single-qubit gate fidelity 99.8%, two-qubit gate fidelity 99.5% in ²⁸Si/SiGe
  • Exchange-based CZ gate via barrier control

Hot silicon qubits — Petit et al. (2020):

  • Universal quantum logic at 1.1 K operating temperature
  • Two-qubit gate fidelity >98% above 1 K

Six-qubit processor — Philips et al. (2022):

  • 6-qubit linear array in ²⁸Si/SiGe with nearest-neighbor exchange coupling and universal control

Industry-compatible CMOS qubits — Steinacker, Stuyck et al. / Diraq & imec (2025):

  • First 300mm foundry-fabricated silicon spin qubits exceeding fault-tolerance threshold
  • SPAM fidelity >99.9%, 1Q and 2Q gate fidelities >99%
  • T₁ up to 9.5 s, T₂(Hahn) = 1.9 ms in isotopically enriched ²⁸Si

11-qubit atom processor — Edlbauer, Wang et al. / SQC (2025):

  • 9 nuclear + 2 electron spin qubits in precision-placed phosphorus donors
  • 1Q gate fidelity up to 99.99% (nuclear spin), 2Q CROT fidelity 99.64%
  • Scaling demonstrated without fidelity degradation

Key Metrics

MetricValueNotesFidelity reference
1Q gate fidelity99.8%EDSR with ²⁸Si/SiGeNoiri et al. 2022
1Q gate fidelity (nuclear)99.99%P donor nuclear spin in ²⁸SiEdlbauer, Wang et al. / SQC 2025
2Q gate fidelity99.5%Exchange-based CZ, Si/SiGeNoiri et al. 2022
2Q gate fidelity (CROT)99.64%Electron exchange CROT, P donorsEdlbauer, Wang et al. / SQC 2025
SPAM fidelity>99.9%300mm CMOS foundry Si-MOSSteinacker, Stuyck et al. / Diraq & imec 2025
T₂*120 μsEnriched ²⁸Si, single electronVeldhorst et al. 2014
T₂ (Hahn echo)28 msEnriched ²⁸Si MOSVeldhorst et al. 2014
T₁9.5 s300mm CMOS foundry Si-MOSSteinacker, Stuyck et al. / Diraq & imec 2025
Operating temperature1–1.2 K demonstratedHigher T eases cryogenic requirementsPetit et al. 2020
Qubit pitch60–100 nmGate-defined dot spacing

Scaling Considerations

  • CMOS compatibility: Fabrication leverages existing semiconductor foundry processes (Intel, GlobalFoundries, imec).
  • Valley splitting variability: Atomic-scale interface roughness causes dot-to-dot variation in valley splitting, currently a yield limiter.
  • Wiring density: Each dot requires ~3–5 DC gates + RF lines. Crossbar architectures and shared gate control are active research areas.
  • Operating temperature: Demonstrations at 1 K (vs. 10–20 mK for superconducting) significantly reduce cryogenic overhead.
  • Largest demonstrated (gate-defined QD): 6-qubit linear array (Philips et al. 2022), 12-dot devices in testing.
  • Largest demonstrated (donor-based): 11-qubit atom processor with 9 nuclear + 2 electron spin qubits (SQC, 2025).
  • Industrial fabrication: Diraq/imec demonstrated fault-tolerant-threshold fidelities on standard 300mm CMOS line (2025).

References

Original proposal

Experimental demonstrations

Linked Papers