Figure

Description

The tetron is a topological qubit design encoding quantum information in the joint fermion parity of four Majorana zero modes (MZMs) arranged in an H-shaped semiconductor-superconductor heterostructure. The qubit states and correspond to even and odd total parity of MZM pairs, and are topologically protected against local perturbations. The tetron is the architecture behind Microsoft’s Majorana 1 processor (2025).

Four MZMs are hosted at the endpoints of two parallel topological superconductor segments connected by a trivial superconducting bridge (forming an “H” shape). The logical qubit is encoded in the parity degree of freedom:

where is the fermion parity of MZM pair .

Gate operations use measurement-based braiding: joint parity measurements of MZM pairs implement effective braiding without physically moving quasiparticles. Parity readout uses quantum dot sensors coupled to MZM pairs via charge sensing. The complete Clifford group is achieved from single-qubit parity measurements plus two-qubit joint measurements.

Microsoft’s 2025 Majorana 1 processor implements 8 tetron qubits using InAs/Al heterostructures (“topoconductors”). Key claims include topological gap protocol passed, controlled MZM parity, and a path toward 4×2 arrays with entanglement, targeting ~10× reduction in QEC overhead compared to conventional superconducting qubits.

Hamiltonian

Low-energy effective Hamiltonian for four MZMs:

where are Majorana operators (, ) and are exponentially suppressed overlap energies. Topological protection: where is the separation and the coherence length.

Motivation

  • Topological protection: Qubit states are protected by topology — local perturbations cannot distinguish from , giving exponentially suppressed error rates.
  • Measurement-only gates: No physical braiding needed — simplifies device layout and eliminates braiding-speed limitations.
  • QEC overhead reduction: Microsoft claims ~10× fewer physical qubits needed for fault-tolerant computation vs. transmon + surface code.
  • Scalable architecture: H-shaped design is lithographically defined and compatible with semiconductor fabrication; 4×2 arrays are near-term targets.

Key Metrics

MetricValueNotesFidelity reference
Topological gap~20–40 μeVInAs/Al topoconductorAghaee et al. 2025
MZM count4 per tetronH-shaped deviceKarzig et al. 2017
Parity lifetimeTBDKey open metric
QEC overhead reduction~10× claimedvs. transmon surface codeAghaee et al. 2025

Scaling Considerations

  • Measurement-only topological QC: No physical braiding needed — simplifies device layout.
  • Modular arrays: 4×2 tetron arrays planned as building blocks for larger processors.
  • QEC synergy: Topological protection at physical level reduces logical overhead.
  • Materials challenge: Requires pristine semiconductor-superconductor interfaces with hard induced gap.

References

Original proposal

Experimental progress

Linked Papers